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UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

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Shenzhen Aochuan Technology Co., Ltd

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UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

Brand Name : AOK

Model Number : UTP100

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 1000pcs

Payment Terms : T/T

Delivery Time : 13-15working days

Packaging Details : 400mmx200mm

Product name : Ultra Soft Thermal Pad Cooling gap filling materials with 1.0w thermal conductivity

Composition : Ceramic Filler

Color : Brick Red

Flammability : V-0

Density : 2.5(g/cc)

Thermal conductivity(W/m.K) : 1.0

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Ultra Soft Thermal Pad Cooling gap filling materials with 1.0W/m.K thermal conductivity

Attribute	Value	Test Method
Composition	Ceramic Filler, Silicone, and Reinforced Fiberglass	-
Color	White and Brick Red	Visual
Thickness(mm)	0.5~12.0	ASTM D374
Density(g/cc)	2.5	ASTM D792
Hardness(shore oo)	30±5	ASTM D2240
Tensile Strength(KN/m)	2.5	ASTM D624
Elongation(%)	60	ASTM D412
Usage Temperature(℃)	-40~150	--
Electrical
Breakdown Voltage(kv/mm)	≥7.0	ASTM D149
Dielectric Constant(@10mhz)	5.7	ASTM D150
Volume Resistivity(Ω.cm)	1.0*10¹³	ASTM D257
Flammability	V-0	UL94
Thermal
Thermal conductivity(W/m.K)	1.0±0.1	ASTM D5470

Product feature:
■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

UL Practical Ultra Soft Thermal Pad CPU Cooling Multipurpose

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