Home > Thermally Conductive Encapsulant >

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

Product Categories

Thermal Conductive Pad [58]
Ultra Soft Thermal Pad [56]
Silicone Free Thermal Pad [34]
Heat Sink Thermal Grease [40]
Thermally Conductive Encapsulant [37]
Thermal Conductive Gap Filler [31]
Liquid Gap Filler [26]
Electrical Insulation Sheet [30]
Thermal Pad Material [40]
Thermal Insulation Pad [40]

Shenzhen Aochuan Technology Co., Ltd

Contact Now

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

Brand Name : AOK

Model Number : GF

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 400ml(200mL each part)

Payment Terms : T/T

Delivery Time : 13-15working days

Packaging Details : 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

Product Name : Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With OBC

Composition : Ceramic filler + Silicone

Density : 1.8(g/cc)

Breakdown Voltage : ≥10（kv/mm）

Thermal Resistance : 0.15 (℃-in2/W)0.1mm@50psi

Dielectric Constant : 5.5（@10mhz）

Contact Now

Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With OBC

Attribute	Value	Test Method
Composition	Ceramic filler + Silicone	-
Color/Component A	White	Visual
Color/Component B	Sliver Grey	Visual
Density(g/cc)	1.8	ASTM D792
Usage Temperature(℃)	-40~150	--
Electrical
Breakdown Voltage(kv/mm)	≥10.0	ASTM D149
Dielectric Constant(@10mhz)	5.5	ASTM D150
Volume Resistivity(Ω.cm)	1.0*10¹⁵	ASTM D257
Flammability	V-0	UL94
Thermal
Thermal conductivity(W/m.K)	0.8	ASTM D5470
Viscosity/Component A (cps)	4500	ASTM D2196
Viscosity/Component B (cps)	4500	ASTM D2196
Hradness,after cure(shore OO)	60	ASTM D22240
Working Time@25℃(min)	30	ISO 9048

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

Purchasing Information

Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes

Storage

Store in a cool, dry, well-ventilated place.

Shelf life

Shelf life of the product is 12 months after date of shipment.

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal

Product Tags:

Shockproof Electrical Potting Compound

Durable Electrical Potting Compound

OBC Electronics Encapsulation Epoxy

Shockproof Durable Electrical Potting Compound , OBC Electronics Encapsulation gap filler thermal Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shenzhen Aochuan Technology Co., Ltd
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!